Single-Chip and Bound/Embedded Working Group Updates (C21b)
Both the Single-Chip and Bound/Embedded Working Groups within the CMUF are on their second year of existence. This talk will focus on what each group has accomplished in the last year. The following topics would be covered separately for each of the two working groups:
1. New IGs that have been published and their technical contents
2. New guidance that is currently in process at the time of ICMC
3. Goals for the groups going forward into 2023 including a discussion about composition model concepts that the Bound/Embedded Working Group is hoping to introduce to FIPS.